Taekwang Fine Chemical’s thermal adhesives can be cured at low temperature and short time for various materials, hence it can prevent damage of some parts which are susceptible to heat in the camera module.
Taekwang’s T-series adhesive can provide adhesive with consistent quality to customers needed low-temperature and high adhesion curing process.
Taekwang’s T-series adhesive can provide adhesive with consistent quality to customers needed low-temperature and high adhesion curing process.
- Low-temperature curability
- Controlled flowability of adhesive for customers.
- Low shrinkage
- Excellent adhesion for various materials
- Providing constant quality of adhesive
| Product | Application | Viscosity (cps @25℃) |
Ti | Tg (℃) |
Work life (days) |
Curing Condition | Property |
|---|---|---|---|---|---|---|---|
| T1241 | Housing Assembly |
20,000 | 4.5 | 36 | 3 | 100℃ 3min snap cure 80℃ 20min oven cure |
Fast Curing High adhesion. |
| T1361 | Housing Assembly |
30,000 | 6 | 37 | 3 | 100℃ 3min snap cure 80℃ 20min oven cure |
Fast Curing High viscosity. |
| T1251 | Housing Assembly |
24,000 | 5 | 52 | 2 | 120℃ 40sec snap cure 70℃ 20min oven cure |
Very Fast Curing High adhesion |
| T1131 | Housing Assembly |
9,000 | 3.5 | 37 | 2 | 120℃ 40sec snap cure 70℃ 20min oven cure |
Very Fast Curing Low viscosity |
| T8300 | Housing Assembly |
15,000 | 3.0 | 100 | 3 | 85℃ 60min oven cure | High Tg (100℃) High modulus |